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0.025 MM High Temperature PI Film Insulation Polyimide Film GBS-91025
0.025 MM High Temperature PI Film Insulation Polyimide Film GBS-91025
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Product Description

Product Description

Width:520mm-1040mm

Length:according to customer's requirement
Thickness: 0.050mm
Accept customization

 

Product Feature

 

Items

Units

Product model

Test Conditions

Standard

WF 50

Thickness


μm

50-51

23℃

ASTM D374

Tensile strength

TD

MPa

≥180

23℃

ASTM D882

MD

≥180


Elongation

TD

%

≥70

23℃

ASTM D882

MD

≥70


Young’s Modulus


GPa

≥3.1

23℃

ASTM D882

Dielectric Constant



3.5±0.4

1MHz 23℃

ASTM D150

Dielectric Dissipaion Factor



≤0.004

1MHz 23℃

ASTM D150

Volume Resisticity


Ω•cm

>1012

500V 23℃

ASTM D257

Surface Resistivity


Ω

>1014

500V 23℃

ASTM D257

Dielectric Strength


v/μm

≥260

23℃

ASTM D149

CTE


Ppm/℃

30±5
30±5

100~200℃

200~300℃

ASTM D696

Shrinkage Rate


%

≤0.08

200℃,2Hr

ASTM D5213–04

Water Absorption


%

≤2.2

23℃、soak for 24Hr

ASTM D570

Density


g/cm³

1.44±0.2

23℃

ASTM D1505

Wetting Tension


mN/m

60

23℃

IEC674-2

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Company


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